Thermal design, cooling methods and criterion equation of electronic equipment
The thermal design of electronic products aims to control the temperature of electronic components in an appropriate and reliable
way, so that electronic equipment can operate steadily in the working environment. To ensure reliable thermal dissipation,
the temperature shall be strictly controlled below the specified maximum temperature. Moreover, the thermal design of
electronic equipment shall be conducted simultaneously with circuit design and structural design to take all factors into account.
Specifically, the cooling methods for thermal design of electronic equipment shall be designed with the following factors in
mind: 1. Technical requirements for thermal design of product; 2. Thermal dissipation power of components; 3. The working
environment of electronic equipment; and 4. Volume and surface area.
The common cooling methods for thermal design of electronic equipment include:
1. Free cooling (including heat conduction, free convection, radiation heat transfer)
2. Forced cooling (including forced air cooling, forced mixed liquid cooling)
3. TEC thermoelectric cooling
4. Heat pipe radiator
The cooling method is generally select according to heat flow cryptography and temperature rise requirements of equipment.
Below is a reference diagram for cooling methods.
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