Thermal Interface Materials
As electronic devices continue to increase in power density and thermal load, Thermal Interface Materials (TIMs) play a critical role in reducing thermal resistance between heat-generating components and cooling devices. TIMs are designed to eliminate air gaps caused by surface irregularities and improve thermal conduction efficiency between heat sources and heatsinks
Renxin Thermal Products provides a complete range of Thermal Interface Materials engineered to maximize heat transfer performance, improve system reliability, and support demanding thermal management applications
All thermal conductivity performance is evaluated according to: ASTM D5470
TIM 
Complete TIM product range for various thermal applicationsRenxin offers multiple TIM solutions to meet various application requirements:
Each material is optimized for specific thermal, mechanical, and electrical performance requirements.
Thermal grease offers excellent flowability and surface wetting characteristics, enabling superior filling of microscopic air gaps between mating surfaces.
Key advantages include:
Base Material:
Silicone Oil
Thermally Conductive Fillers:
| Property | Value |
|---|---|
| Thermal Conductivity | 2.0 – 6.0 W/m·K |
| Thermal Resistance | 0.03 – 0.04 °C·in²/W |
| Specific Gravity | 2.3 – 3.32 |
| Volume Resistivity | 3 × 10¹⁴ Ω·cm |
| Operating Temperature | -50°C to 200°C |
| Flame Rating | UL94 V-0 |
Additional characteristics:
Thermal silicone pads are engineered by combining methyl-vinyl silicone rubber with thermally conductive ceramic fillers to achieve high thermal conductivity while maintaining excellent electrical insulation properties.
These materials are widely used in applications where low contact pressure, electrical isolation, and reliable thermal performance are required.
Base Material:
Silicone Rubber
Thermally Conductive Fillers:
| Property | Value | Standard |
|---|---|---|
| Thickness | 0.3 – 6.0 mm | ASTM D374 |
| Hardness | Shore C 18 – 35 | ASTM D2240 |
| Density | 3.5 g/cm³ | ASTM D792 |
| Tear Strength | 3.1 kN/m | ASTM D412 |
| Operating Temperature | -40°C to 200°C | ASTM D344 |
| Breakdown Voltage | ≥ 4 kV | ASTM D149 |
| Volume Resistivity | 1.1 × 10¹⁶ Ω·cm | ASTM D257 |
| Dielectric Constant | 7.15 @1MHz | ASTM D150 |
| Thermal Conductivity | 3.0 – 8.0 W/m·K | ASTM D5470 |
| Flammability Rating | UL94 V-0 | UL Standard |
Accurate thermal conductivity measurement is essential for evaluating TIM performance.
Guarded Hot Plate Method
Measures thermal conductivity under steady-state heat transfer conditions.
Heat Flow Method (ASTM D5470)
A controlled heat flux is applied to the sample. Thermal conductivity is calculated by measuring:
This method is widely used for thermal interface materials.
Transient Hot Wire Method
Measures thermal conductivity through transient heat propagation.
Transient Plane Source (TPS) Method
A nickel sensor acts simultaneously as:
Thermal conductivity is calculated from temperature-dependent resistance changes.
Probe Method
Suitable for rapid material characterization.
Laser Flash Method (ASTM E1461)
A laser pulse heats one side of the sample while an infrared detector measures the temperature response on the opposite side.
The measured thermal diffusivity is then used to calculate thermal conductivity.
Thermal conductivity is defined as the amount of heat transferred through a material 1 meter thick with a temperature difference of 1 Kelvin (or 1°C) across an area of 1 square meter in one second.
Unit: W/m·K
Thermal conductivity is governed by Fourier’s Law of Heat Conduction:
The heat flow density is proportional to the temperature gradient within the material.
Higher thermal conductivity values indicate better heat transfer performance and lower thermal resistance within the thermal management system
Renxin TIM solutions are widely used in:
By combining advanced material technology, strict quality control, and comprehensive thermal engineering expertise, Renxin Thermal Products delivers reliable Thermal Interface Material solutions for next-generation thermal management applications.
